Development and production of tailored housings for electronic devices

Decorative, made from natural materials, and adapted to the local climate

Key Competence: Engineering Integration

The main priority of our design team is to ensure full compatibility between the physical casing and electronic components of the device. The design is carried out taking into account the specifics of the customer's circuitry.

When developing the geometry and structure of the casing, we incorporate:

  • Optimal thermal management: Calculation of convection and heat dissipation to prevent component overheating.
  • Radio transparency: Selection of materials and wall thicknesses to minimize signal attenuation for built-in antennas (Wi-Fi, BLE, GSM, LoRaWAN).
  • Accuracy of measurements: Design of ventilation channels for precise air intake by built-in temperature, humidity, and CO₂ sensors without distorting readings due to board heating.
  • Assembly technicity: Optimization for automated or manual assembly, calculation of tolerances and mounting positions for rigid fixation of boards and connectors.

Areas of Activity

Custom and Designer Casings

Development of individual constructive solutions from scratch. Designing geometry for non-standard board dimensions and specific ergonomic requirements of the product.
Examples of our work can be found here.

Casings made from natural materials

Dedicated production direction. Manufacturing casing elements from wood, bamboo, and specialized biocomposites. Addressing challenges of stabilizing natural materials to maintain casing geometry when environmental humidity changes.

Casings with enhanced protection

Designing products for operation in challenging conditions. Implementing sealing elements (gaskets, seals) to provide the necessary protection class against moisture and dust (according to the IP standard), as well as resistance to mechanical damage.

Interaction Stages

  1. Analysis of Technical Specifications and Board: Studying the 3D model (or physical prototype) of the customer's printed circuit board.
  2. Design: Developing design documentation (DD) and creating a digital model of the casing.
  3. Prototyping: Manufacturing a test sample to check assembly and conduct initial tests.
  4. Mass Production: Producing a batch of products in accordance with agreed technological maps.

How to Make a Casing from Natural Materials Yourself?

One of our developments, Garden Probe with External Sensors, allows the customer to independently create decorative casings from natural materials, and more.
Below is a brief guide:

Technical requirements for the design of decorative cases for climate sensors

The light sensor should be located high enough above the ground and should never fall into the shadow of the decorative case
The light sensor should be located high enough above the ground and should never fall into the shadow of the decorative case
It is better to place the main board of the device high. The transmitting antenna is located directly on the board, and low sensors greatly lose in communication range
It is better to place the main board of the device high. The transmitting antenna is located directly on the board, and low sensors greatly lose in communication range
The soil moisture sensor must be located at the bottom of the case. The sensing element must be permanently immersed into the ground
The soil moisture sensor must be located at the bottom of the case. The sensing element must be permanently immersed into the ground
But sometimes a low sensor is the only acceptable option. For example, for a flower bed or alpine slide
But sometimes a low sensor is the only acceptable option. For example, for a flower bed or alpine slide
The central board must be protected from precipitation, and the temperature sensor must be protected from heating by sunlight. In this case, both problems are solved by a ventilated foam housing
The central board must be protected from precipitation, and the temperature sensor must be protected from heating by sunlight. In this case, both problems are solved by a ventilated foam housing
The temperature sensor must have maximum ventilation. In this case it is located on the main board
The temperature sensor must have maximum ventilation. In this case it is located on the main board